Simple and facile synthesis of a CuS film using a copper formate–thioacetamide complex ink
Current Applied Physics 66 巻
81-87 頁
2024-07-03 発行
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この文献の参照には次のURLをご利用ください : https://ir.lib.hiroshima-u.ac.jp/00055852
ファイル情報(添付) |
利用開始日
2026-07-03
4.45 MB
種類 :
全文
エンバーゴ :
2026-07-03
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タイトル ( eng ) |
Simple and facile synthesis of a CuS film using a copper formate–thioacetamide complex ink
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作成者 |
Tachibana Tomoyuki
Osaki Yuri
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収録物名 |
Current Applied Physics
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巻 | 66 |
開始ページ | 81 |
終了ページ | 87 |
抄録 |
In this study, we developed a simple and facile synthesis method for producing CuS films at low temperatures. The method uses self-reducible complex inks comprising copper formate (Cuf) as the copper source and thioacetamide (TA) as both the sulfur source and complexing agent. The thermal properties of complex inks with different TA/Cuf ratios (0.5–2.0) were analyzed. The ink with a TA/Cuf ratio of 1 exhibited a significant decrease in the reduction temperature. The synthesis of a CuS film involved calcination of the ink at 140 °C; however, some residual Cuf was observed. Introducing hexanol to the ink, aimed at prolonging the liquid-phase reaction, yielded a pure CuS film that contained agglomerated particles. The thermal reduction pathway of Cuf to CuS was analyzed through thermogravimetric–mass spectrometric analysis, and the results revealed that the low-temperature synthesis was attributed to the formation of acetonitrile and formic acid during thermal decomposition of the ink.
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著者キーワード |
Copper sulfide
Copper formate
Thioacetamide
Thermal decomposition
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言語 |
英語
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資源タイプ | 学術雑誌論文 |
出版者 |
Elsevier
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発行日 | 2024-07-03 |
権利情報 |
© 2024. This manuscript version is made available under the CC-BY-NC-ND 4.0 license https://creativecommons.org/licenses/by-nc-nd/4.0/
This is not the published version. Please cite only the published version.
この論文は出版社版ではありません。引用の際には出版社版をご確認、ご利用ください。
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出版タイプ | Accepted Manuscript(出版雑誌の一論文として受付されたもの。内容とレイアウトは出版社の投稿様式に沿ったもの) |
アクセス権 | エンバーゴ期間中 |
収録物識別子 |
[DOI] https://doi.org/10.1016/j.cap.2024.06.017
~の異版である
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備考 | The full-text file will be made open to the public on 3 July 2026 in accordance with publisher's 'Terms and Conditions for Self-Archiving' |