Simple and facile synthesis of a CuS film using a copper formate–thioacetamide complex ink

Current Applied Physics Volume 66 Page 81-87 published_at 2024-07-03
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Title ( eng )
Simple and facile synthesis of a CuS film using a copper formate–thioacetamide complex ink
Creator
Tachibana Tomoyuki
Osaki Yuri
Source Title
Current Applied Physics
Volume 66
Start Page 81
End Page 87
Abstract
In this study, we developed a simple and facile synthesis method for producing CuS films at low temperatures. The method uses self-reducible complex inks comprising copper formate (Cuf) as the copper source and thioacetamide (TA) as both the sulfur source and complexing agent. The thermal properties of complex inks with different TA/Cuf ratios (0.5–2.0) were analyzed. The ink with a TA/Cuf ratio of 1 exhibited a significant decrease in the reduction temperature. The synthesis of a CuS film involved calcination of the ink at 140 °C; however, some residual Cuf was observed. Introducing hexanol to the ink, aimed at prolonging the liquid-phase reaction, yielded a pure CuS film that contained agglomerated particles. The thermal reduction pathway of Cuf to CuS was analyzed through thermogravimetric–mass spectrometric analysis, and the results revealed that the low-temperature synthesis was attributed to the formation of acetonitrile and formic acid during thermal decomposition of the ink.
Keywords
Copper sulfide
Copper formate
Thioacetamide
Thermal decomposition
Language
eng
Resource Type journal article
Publisher
Elsevier
Date of Issued 2024-07-03
Rights
© 2024. This manuscript version is made available under the CC-BY-NC-ND 4.0 license https://creativecommons.org/licenses/by-nc-nd/4.0/
This is not the published version. Please cite only the published version.
この論文は出版社版ではありません。引用の際には出版社版をご確認、ご利用ください。
Publish Type Accepted Manuscript
Access Rights embargoed access
Source Identifier
[DOI] https://doi.org/10.1016/j.cap.2024.06.017 isVersionOf
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