Simple and facile synthesis of a CuS film using a copper formate–thioacetamide complex ink
Current Applied Physics Volume 66
Page 81-87
published_at 2024-07-03
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Title ( eng ) |
Simple and facile synthesis of a CuS film using a copper formate–thioacetamide complex ink
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Creator |
Tachibana Tomoyuki
Osaki Yuri
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Source Title |
Current Applied Physics
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Volume | 66 |
Start Page | 81 |
End Page | 87 |
Abstract |
In this study, we developed a simple and facile synthesis method for producing CuS films at low temperatures. The method uses self-reducible complex inks comprising copper formate (Cuf) as the copper source and thioacetamide (TA) as both the sulfur source and complexing agent. The thermal properties of complex inks with different TA/Cuf ratios (0.5–2.0) were analyzed. The ink with a TA/Cuf ratio of 1 exhibited a significant decrease in the reduction temperature. The synthesis of a CuS film involved calcination of the ink at 140 °C; however, some residual Cuf was observed. Introducing hexanol to the ink, aimed at prolonging the liquid-phase reaction, yielded a pure CuS film that contained agglomerated particles. The thermal reduction pathway of Cuf to CuS was analyzed through thermogravimetric–mass spectrometric analysis, and the results revealed that the low-temperature synthesis was attributed to the formation of acetonitrile and formic acid during thermal decomposition of the ink.
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Keywords |
Copper sulfide
Copper formate
Thioacetamide
Thermal decomposition
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Language |
eng
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Resource Type | journal article |
Publisher |
Elsevier
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Date of Issued | 2024-07-03 |
Rights |
© 2024. This manuscript version is made available under the CC-BY-NC-ND 4.0 license https://creativecommons.org/licenses/by-nc-nd/4.0/
This is not the published version. Please cite only the published version.
この論文は出版社版ではありません。引用の際には出版社版をご確認、ご利用ください。
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Publish Type | Accepted Manuscript |
Access Rights | embargoed access |
Source Identifier |
[DOI] https://doi.org/10.1016/j.cap.2024.06.017
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Remark | The full-text file will be made open to the public on 3 July 2026 in accordance with publisher's 'Terms and Conditions for Self-Archiving' |