Stable shape for copper film using low-temperature thermal decomposition of copper microparticles for printable electronics
Chemical Physics Letters 761 巻
138055- 頁
2020-12-16 発行
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この文献の参照には次のURLをご利用ください : https://ir.lib.hiroshima-u.ac.jp/00051519
| ファイル情報(添付) | |
| タイトル ( eng ) |
Stable shape for copper film using low-temperature thermal decomposition of copper microparticles for printable electronics
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| 作成者 |
Iwamura Yuta
Indra Wahyudhin Fathona
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| 収録物名 |
Chemical Physics Letters
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| 巻 | 761 |
| 開始ページ | 138055 |
| 抄録 |
A paste of copper microparticles, formic acid, and octylamine was developed to produce thick copper films with a stable shape and low electrical resistivity via low-temperature calcination. This study examined (1) the effect of cleaning the copper microparticle surface with formic acid, (2) the effect of calcination temperature, and (3) the effect that the addition of amine exerted on volume resistivity and on the shape of the copper film. The volume resistivities of the thick copper film were measured using a 4-point probe method. The thickness and shape of the copper film was observed via FE-SEM using an optical microscope.
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| 著者キーワード |
Copper particle
Copper formate
Thermal decomposition
Printable electronics
Volume resistivity
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| 言語 |
英語
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| 資源タイプ | 学術雑誌論文 |
| 出版者 |
Elsevier
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| 発行日 | 2020-12-16 |
| 権利情報 |
© 2020. This manuscript version is made available under the CC-BY-NC-ND 4.0 license http://creativecommons.org/licenses/by-nc-nd/4.0/
This is not the published version. Please cite only the published version. この論文は出版社版ではありません。引用の際には出版社版をご確認、ご利用ください。
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| 出版タイプ | Author’s Original（十分な品質であるとして、著者から正式な査読に提出される版） |
| アクセス権 | オープンアクセス |
| 収録物識別子 |
[ISSN] 0009-2614
[DOI] 10.1016/j.cplett.2020.138055
[DOI] https://doi.org/10.1016/j.cplett.2020.138055
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| 備考 | The full-text file will be made open to the public on 4 Oct 2022 in accordance with publisher's 'Terms and Conditions for Self-Archiving'. |
