Stable shape for copper film using low-temperature thermal decomposition of copper microparticles for printable electronics

Yabuki Akihiro

Iwamura Yuta

Indra Wahyudhin Fathona

Lee Ji Ha

Chemical Physics Letters

A paste of copper microparticles, formic acid, and octylamine was developed to produce thick copper films with a stable shape and low electrical resistivity via low-temperature calcination. This study examined (1) the effect of cleaning the copper microparticle surface with formic acid, (2) the effect of calcination temperature, and (3) the effect that the addition of amine exerted on volume resistivity and on the shape of the copper film. The volume resistivities of the thick copper film were measured using a 4-point probe method. The thickness and shape of the copper film was observed via FE-SEM using an optical microscope.

Copper particle

Copper formate

Thermal decomposition

Printable electronics

Volume resistivity

eng

Elsevier

© 2020. This manuscript version is made available under the CC-BY-NC-ND 4.0 license http://creativecommons.org/licenses/by-nc-nd/4.0/

This is not the published version. Please cite only the published version. この論文は出版社版ではありません。引用の際には出版社版をご確認、ご利用ください。

[ISSN] 0009-2614

[DOI] 10.1016/j.cplett.2020.138055

[DOI] https://doi.org/10.1016/j.cplett.2020.138055