Electrical conductivity of copper nanoparticle thin films annealed at low temperature
Thin Solid Films 518 巻 23 号
7033-7037 頁
2010-09-30 発行
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| ファイル情報(添付) | |
| タイトル ( eng ) |
Electrical conductivity of copper nanoparticle thin films annealed at low temperature
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| 作成者 |
Arriffin Norzafriza
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| 収録物名 |
Thin Solid Films
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| 巻 | 518 |
| 号 | 23 |
| 開始ページ | 7033 |
| 終了ページ | 7037 |
| 抄録 |
Copper nanoparticles with a mean diameter of 20 nm were used to prepare electrical conductive films at low temperature. After dispersal in an organic solvent, the copper nanoparticle pastes were coated onto a glass substrate, which was then annealed under various conditions to investigate the effects of various atmospheric conditions, such as air, nitrogen gas or hydrogen gas, as well as different annealing temperatures. Two-step annealing, which first involves oxidation in air followed by reduction, is effective in the preparation of high electrical conductive copper nanoparticle films. The copper nanoparticle films that were calcined in air for 1 h and then hydrogen gas for 1 h at a low temperature of 200 C showed a low resistivity of 2 x 10(-5) Omega, cm.
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| 著者キーワード |
Copper
Nanoparticles
Conductive film
Oxidation
Reduction
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| NDC分類 |
金属工学・鉱山工学 [ 560 ]
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| 言語 |
英語
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| 資源タイプ | 学術雑誌論文 |
| 出版者 |
Elsevier Science SA
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| 発行日 | 2010-09-30 |
| 権利情報 |
Copyright (c) 2010 Elsevier B.V.
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| 出版タイプ | Author’s Original（十分な品質であるとして、著者から正式な査読に提出される版） |
| アクセス権 | オープンアクセス |
| 収録物識別子 |
[ISSN] 0040-6090
[DOI] 10.1016/j.tsf.2010.07.023
[NCID] AA00863068
[DOI] http://dx.doi.org/10.1016/j.tsf.2010.07.023
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