Thermal Propagation and Device-Temperature Prediction Techniques for Power Semiconductor Modules with Circuit Simulators
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| File | |
| Title ( eng ) |
Thermal Propagation and Device-Temperature Prediction Techniques for Power Semiconductor Modules with Circuit Simulators
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| Title ( jpn ) |
回路シミュレータを用いたパワー半導体モジュールにおける熱伝搬と素子温度予測技術
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| Creator |
Kojima Takashi
|
| NDC |
Electrical engineering [ 540 ]
|
| Language |
eng
|
| Resource Type | doctoral thesis |
| Rights |
Copyright(c) by Author
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| Access Rights | open access |
| Source Identifier |
(1) Capability of Electrothermal simulation for Automotive Power Application Using Novel Laterally Diffused Metal Oxide Semiconductor Model, T. Kojima, T. Kajiwara, M. Miyake, U. Feldmann and M. Miura-Mattausch, Japanese Journal of Applied Physics, Vol. 48, No. 4, Issue 2, 04C079 (6 pages), 2009.
references
(1) Extraction of Accurate Thermal Compact Models for Fast Electro-Thermal Simulation of IGBT Modules in Hybrid Electric Vehicles, M. Ciappa, W. Fichtner, T. Kojima, Y. Yamada and Y. Nishibe, Microelectronics Reliability, Vol 45, pp. 1694-1699, 2005.
references
[DOI] http://dx.doi.org/10.1143/JJAP.48.04C079
references
[DOI] http://dx.doi.org/10.1016/j.microrel.2005.07.083
references
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| Dissertation Number | 甲第4820号 |
| Degree Name | |
| Date of Granted | 2009-03-06 |
| Degree Grantors |
広島大学
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