Compaction of TiO2 suspension by using dual ionic thermosensitive polymers

Separation and Purification Technology 63 巻 2 号 319-323 頁 2008-10-22 発行
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タイトル ( eng )
Compaction of TiO2 suspension by using dual ionic thermosensitive polymers
作成者
Sakohara Shuji
Hinago Ryosuke
Ueda Hidenori
収録物名
Separation and Purification Technology
63
2
開始ページ 319
終了ページ 323
抄録
The compaction of TiO2 suspension as a negatively charged model suspension by using dual ionic thermosensitive polymers was investigated. First, a cationic thermosensitive polymer, poly(N-isopropylacrylamide-co-N,N-dimethylaminopropylacrylamide) was added to the TiO2 suspension, followed by an anionic thermosensitive polymer, poly(N-isopropyl- acrylamide-co-acrylic acid). By adding the latter, a polymer complex with the cationic thermosensitive polymer adsorbed on the particle is formed, and charge neutralization occurs to decrease the transition temperature of the polymer adsorbed on the TiO2 particles. As a result, the compaction of the TiO2 suspended particles due to the hydrophobic interaction of the adsorbed polymers occurs at a relatively low temperature by applying an adequate mechanical force with a plunger. In order to initiate the compaction, it was necessary to cover the surface of the TiO2 particles sufficiently by the cationic thermosensitive polymer molecules, and the optimum dosage of the anionic thermosensitive polymer was observed. The transition temperature of the polymer complex adsorbed on the TiO2 particles was dependent on the ratio of the dosages of the cationic and anionic thermosensitive polymers.
著者キーワード
Compaction
Cationic thermosensitive polymer
Anionic thermosensitive polymer
Dual polymer
Hydrophobic interaction
Polymer complex
Transition temperature
NDC分類
化学 [ 430 ]
言語
英語
資源タイプ 学術雑誌論文
出版者
Elsevier Science BV
発行日 2008-10-22
権利情報
Copyright (c) 2008 Elsevier B.V.
出版タイプ Author’s Original(十分な品質であるとして、著者から正式な査読に提出される版)
アクセス権 オープンアクセス
収録物識別子
[ISSN] 1383-5866
[DOI] 10.1016/j.seppur.2008.05.014
[NCID] AA11136087
[DOI] http://dx.doi.org/10.1016/j.seppur.2008.05.014