Precipitation and Cr depletion profiles of Inconel 182 during heat treatments and laser surface melting
Journal of Materials Processing Technology 209 巻 1 号
416-425 頁
2009-01-01 発行
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JMaterProcessTechnol_209_416.pdf
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種類 :
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タイトル ( eng ) |
Precipitation and Cr depletion profiles of Inconel 182 during heat treatments and laser surface melting
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作成者 |
Baoa Gang
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収録物名 |
Journal of Materials Processing Technology
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巻 | 209 |
号 | 1 |
開始ページ | 416 |
終了ページ | 425 |
抄録 |
Thermodynamic and kinetic modeling was conducted to simulate Cr depletion profiles near grain boundaries in Inconel 182 during heat treatments and laser surface melting (LSM) using Thermo-Calc and DICTRA code. The effect of Nb addition was also considered in the modeling. Based on the good agreement with Cr concentration distributions during the heat treatments measured experimentally, Cr depletion profiles adjacent to grain boundaries during the heat treatments and the LSM process were modeled. The Cr depletion profiles were evaluated using the Cr depletion area below the critical Cr concentration for IGC/IGSCC (Intergranular Cracking/Intergranular Stress Corrosion Cracking) susceptibility (12 mass%). Compared with the result of the Streicher test, the calculated Cr depletion areas showed good agreement with IGC/IGSCC susceptibilities. The sample after stress relief (SR) treatment had the largest Cr depletion area and showed the poorest IGC/IGSCC resistance. Cr depletion showed some recovery during subsequent low temperature sensitization (LTS). The sample after the LSM process had the smallest Cr depletion area and showed the best IGC/IGSCC resistance.
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著者キーワード |
Cr depletion
IGC/IGSCC susceptibility
Inconel 182
LSM
precipitation
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NDC分類 |
金属工学・鉱山工学 [ 560 ]
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言語 |
英語
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資源タイプ | 学術雑誌論文 |
出版者 |
Elsevier Science S.A.
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発行日 | 2009-01-01 |
権利情報 |
Copyright (c) 2008 Published by Elsevier B.V.
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出版タイプ | Author’s Original(十分な品質であるとして、著者から正式な査読に提出される版) |
アクセス権 | オープンアクセス |
収録物識別子 |
[ISSN] 0924-0136
[DOI] 10.1016/j.jmatprotec.2008.02.021
[NCID] AA10748601
[DOI] http://dx.doi.org/10.1016/j.jmatprotec.2008.02.021
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