Low-temperature synthesis of copper conductivity film from a copper formate amine complex with a low boiling point

Yabuki Akihiro

Kawahara Sayuri

Kang Soonchul

Indra Wahyudhin Fathona

Materials Science and Engineering: B

A low-temperature synthesis of copper conductive film was conducted at the near-decomposition-onset temperature of copper formate-amine complex inks. Amines with a low boiling point (butylamine (b.p. 78 °C), pentylamine (b.p. 104 °C), and hexylamine (b.p. 132 °C)) were mixed with copper formate to prepare the complex inks, followed by calcination at various temperatures. The copper film calcined from copper-pentylamine complex ink showed the lowest level of resistivity. The optimal molar ratio for the conversion of pentylamine to copper formate was set at 2.4. That ratio resulted in a volume resistivity of 5.7 µΩ cm following calcination at 110 °C. The composition of the copper film was dominated by three sizes of nanoparticles, which were generated via a two-step formation of nanoparticles.

Onset temperature

Amines

Complex ink

Conductive film

Copper

eng

Elsevier

© 2020. This manuscript version is made available under the CC-BY-NC-ND 4.0 license http://creativecommons.org/licenses/by-nc-nd/4.0/

This is not the published version. Please cite only the published version. この論文は出版社版ではありません。引用の際には出版社版をご確認、ご利用ください。

[ISSN] 0921-5107

[DOI] 10.1016/j.mseb.2020.114743

[DOI] https://doi.org/10.1016/j.mseb.2020.114743