Interactions between thermal cycled resilient denture lining materials, salivary and serum pellicles and Candida albicans in vitro: Part II. Effects on fungal colonization

Journal of Oral Rehabilitation Volume 27 Issue 2 Page 124-130 published_at 2000-02
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Title ( eng )
Interactions between thermal cycled resilient denture lining materials, salivary and serum pellicles and Candida albicans in vitro: Part II. Effects on fungal colonization
Creator
Jin Chen
Hamada Taizo
Makihira Seicho
Kumagai Hiroshi
Murata Hiroshi
Source Title
Journal of Oral Rehabilitation
Volume 27
Issue 2
Start Page 124
End Page 130
Abstract
In the present study, the growth of a single isolate of Candida albicans on saliva-, serum-coated or protein free (uncoated), thermocycled (4–70 °C for 1 min, respectively; 0, 1000 and 10 000 times) seven commercial soft lining materials were investigated, by adenosine triphosphate (ATP) analysis. In the case of control resilient liners (not thermocycled and uncoated), the fungal colonization appeared to depend upon the type of commercial resilient liner used. Thus, the lowest colonization was observed with fluoric and heat-cured silicone materials, cold-cured silicone materials, except for one product, and heat-cured acrylic resin exhibited the highest colonization capacity, and cold-cured acrylic resilient liners exhibited the intermediate. However, the fungal colonization on the materials was significantly promoted both by thermal cycling ( anova, P<0·01) and a layer of protein coating (saliva, P<0·01; serum, P<0·01). These results, taken together, suggest that the ageing of the materials and the biological fluids of the host promote yeast colonization on resilient lining materials.
Language
eng
Resource Type journal article
Publisher
Blackwell Publishing
Date of Issued 2000-02
Rights
Copyright (c) 2000 Blackwell Publishing. The definitive version is available at www.blackwell-synergy.com
Publish Type Author’s Original
Access Rights open access
Source Identifier
[ISSN] 0305-182X
[DOI] 10.1046/j.1365-2842.2000.00485.x
[PMID] 10672148
[NCID] AA00704042
[DOI] http://dx.doi.org/10.1046/j.1365-2842.2000.00485.x