Stable shape for copper film using low-temperature thermal decomposition of copper microparticles for printable electronics
Chemical Physics Letters Volume 761
Page 138055-
published_at 2020-12-16
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Title ( eng ) |
Stable shape for copper film using low-temperature thermal decomposition of copper microparticles for printable electronics
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Creator |
Iwamura Yuta
Indra Wahyudhin Fathona
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Source Title |
Chemical Physics Letters
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Volume | 761 |
Start Page | 138055 |
Abstract |
A paste of copper microparticles, formic acid, and octylamine was developed to produce thick copper films with a stable shape and low electrical resistivity via low-temperature calcination. This study examined (1) the effect of cleaning the copper microparticle surface with formic acid, (2) the effect of calcination temperature, and (3) the effect that the addition of amine exerted on volume resistivity and on the shape of the copper film. The volume resistivities of the thick copper film were measured using a 4-point probe method. The thickness and shape of the copper film was observed via FE-SEM using an optical microscope.
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Keywords |
Copper particle
Copper formate
Thermal decomposition
Printable electronics
Volume resistivity
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Language |
eng
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Resource Type | journal article |
Publisher |
Elsevier
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Date of Issued | 2020-12-16 |
Rights |
© 2020. This manuscript version is made available under the CC-BY-NC-ND 4.0 license http://creativecommons.org/licenses/by-nc-nd/4.0/
This is not the published version. Please cite only the published version. この論文は出版社版ではありません。引用の際には出版社版をご確認、ご利用ください。
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Publish Type | Author’s Original |
Access Rights | open access |
Source Identifier |
[ISSN] 0009-2614
[DOI] 10.1016/j.cplett.2020.138055
[DOI] https://doi.org/10.1016/j.cplett.2020.138055
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Remark | The full-text file will be made open to the public on 4 Oct 2022 in accordance with publisher's 'Terms and Conditions for Self-Archiving'. |