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ID 30798
本文ファイル
著者
Arriffin, Norzafriza
キーワード
Copper
Nanoparticles
Conductive film
Oxidation
Reduction
NDC
金属工学・鉱山工学
抄録(英)
Copper nanoparticles with a mean diameter of 20 nm were used to prepare electrical conductive films at low temperature. After dispersal in an organic solvent, the copper nanoparticle pastes were coated onto a glass substrate, which was then annealed under various conditions to investigate the effects of various atmospheric conditions, such as air, nitrogen gas or hydrogen gas, as well as different annealing temperatures. Two-step annealing, which first involves oxidation in air followed by reduction, is effective in the preparation of high electrical conductive copper nanoparticle films. The copper nanoparticle films that were calcined in air for 1 h and then hydrogen gas for 1 h at a low temperature of 200 C showed a low resistivity of 2 x 10(-5) Omega, cm.
掲載誌名
Thin Solid Films
518巻
23号
開始ページ
7033
終了ページ
7037
出版年月日
2010-09-30
出版者
Elsevier Science SA
ISSN
0040-6090
NCID
出版者DOI
言語
英語
NII資源タイプ
学術雑誌論文
広大資料タイプ
学術雑誌論文
DCMIタイプ
text
フォーマット
application/pdf
著者版フラグ
author
権利情報
Copyright (c) 2010 Elsevier B.V.
関連情報URL
部局名
工学研究科