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ID 35703
本文ファイル
著者
Yoon, Gil Ho
Jeong, Seung Hyun
Kobashi, Makoto
キーワード
Topology optimization
Stress constraints
Heat conduction
Thermal expansion
Sensitivity analysis
and resolved by introducing a multi-stress constraint corresponding to several thermal con
NDC
技術・工学
抄録(英)
In this research, a topology optimization with constraints of structural strength and thermal conductivity is proposed. The coupled static linear elastic and heat conduction equations of state are considered. The optimization problem was formulated; viz., minimizing the volume under the constraints of p-norm stress and thermal compliance introducing the qp-relaxation method to avoid the singularity of stress-constraint topology optimization. The proposed optimization methodology is implemented employing the commonly used solid isotropic material with penalization (SIMP) method of topology optimization. The density function is updated using sequential linear programming (SLP) in the early stage of optimization. In the latter stage of optimization, the phase field method is employed to update the density function and obtain clear optimal shapes without intermediate densities. Numerical examples are provided to illustrate the validity and utility of the proposed methodology. Through these numerical studies, the dependency of the optima to the target temperature range due to the thermal expansion is confirmed. The issue of stress concentration due to the thermal expansion problem in the use of the structure in a wide temperature range is also clarified, and resolved by introducing a multi-stress constraint corresponding to several thermal conditions.
掲載誌名
Computer Methods in Applied Mechanics and Engineering
276巻
開始ページ
341
終了ページ
361
出版年月日
2014-07-01
出版者
Elsevier
ISSN
0045-7825
NCID
出版者DOI
言語
英語
NII資源タイプ
学術雑誌論文
広大資料タイプ
学術雑誌論文
DCMIタイプ
text
フォーマット
application/pdf
著者版フラグ
author
権利情報
Copyright (c) 2014 Elsevier B.V. All rights reserved.
関連情報URL
部局名
工学研究科