Low-temperature synthesis of copper conductivity film from a copper formate amine complex with a low boiling point
Indra Wahyudhin Fathona
A low-temperature synthesis of copper conductive film was conducted at the near-decomposition-onset temperature of copper formate-amine complex inks. Amines with a low boiling point (butylamine (b.p. 78 °C), pentylamine (b.p. 104 °C), and hexylamine (b.p. 132 °C)) were mixed with copper formate to prepare the complex inks, followed by calcination at various temperatures. The copper film calcined from copper-pentylamine complex ink showed the lowest level of resistivity. The optimal molar ratio for the conversion of pentylamine to copper formate was set at 2.4. That ratio resulted in a volume resistivity of 5.7 µΩ cm following calcination at 110 °C. The composition of the copper film was dominated by three sizes of nanoparticles, which were generated via a two-step formation of nanoparticles.
Materials Science and Engineering: B
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Graduate School of Advanced Science and Engineering
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