Stable shape for copper film using low-temperature thermal decomposition of copper microparticles for printable electronics
Indra Wahyudhin Fathona
A paste of copper microparticles, formic acid, and octylamine was developed to produce thick copper films with a stable shape and low electrical resistivity via low-temperature calcination. This study examined (1) the effect of cleaning the copper microparticle surface with formic acid, (2) the effect of calcination temperature, and (3) the effect that the addition of amine exerted on volume resistivity and on the shape of the copper film. The volume resistivities of the thick copper film were measured using a 4-point probe method. The thickness and shape of the copper film was observed via FE-SEM using an optical microscope.
Chemical Physics Letters
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Graduate School of Advanced Science and Engineering
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