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ID 51519
creator
Iwamura, Yuta
Indra Wahyudhin Fathona
subject
Copper particle
Copper formate
Thermal decomposition
Printable electronics
Volume resistivity
abstract
A paste of copper microparticles, formic acid, and octylamine was developed to produce thick copper films with a stable shape and low electrical resistivity via low-temperature calcination. This study examined (1) the effect of cleaning the copper microparticle surface with formic acid, (2) the effect of calcination temperature, and (3) the effect that the addition of amine exerted on volume resistivity and on the shape of the copper film. The volume resistivities of the thick copper film were measured using a 4-point probe method. The thickness and shape of the copper film was observed via FE-SEM using an optical microscope.
journal title
Chemical Physics Letters
volume
Volume 761
start page
138055
date of issued
2020-12-16
publisher
Elsevier
issn
0009-2614
publisher doi
language
eng
nii type
Journal Article
HU type
Journal Articles
DCMI type
text
format
application/pdf
text version
author
rights
© 2020. This manuscript version is made available under the CC-BY-NC-ND 4.0 license http://creativecommons.org/licenses/by-nc-nd/4.0/
This is not the published version. Please cite only the published version. この論文は出版社版ではありません。引用の際には出版社版をご確認、ご利用ください。
relation url
department
Graduate School of Advanced Science and Engineering
note
The full-text file will be made open to the public on 4 Oct 2022 in accordance with publisher's 'Terms and Conditions for Self-Archiving'.