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ID 51518
file
creator
Sakaguchi, Takuhiro
Indra Wahyudhin Fathona
abstract
A simple fabrication of copper conductive film was accomplished in one step at low temperature under an air atmosphere. The strategy for solving the problem was the use of both aminediol and OH-based solvent for self-reducible copper complex inks. The complex ink consisted of copper formate, aminediol, and various OH-based solvents calcinated at various temperatures, which resulted in a conductive copper film via rapid calcination at low temperature. The ratio of copper formate, aminediol, and OH-based solvent in complex inks was optimized for a higher conductive copper film. The copper film from the complex ink with a ratio of 1 (copper formate) : 2.2 (aminediol) : 1.8 (diol solvent) was rapidly calcined at 180 °C under an air atmosphere and showed approximately 15 μΩ cm, which is approximately 10 times that of bulk copper. The combination of aminediol and OH-based solvent inhibited the oxidation of the copper surface via adsorption. The developed process is applicable to conductive circuits, resistors, and capacitors in the form of oxide films for use as printable electronics fabricated under an air atmosphere.
journal title
New Journal of Chemistry
volume
Volume 44
start page
19880
end page
19884
date of issued
2020-10-28
publisher
Royal Society of Chemistry
issn
1144-0546
1369-9261
publisher doi
language
eng
nii type
Journal Article
HU type
Journal Articles
DCMI type
text
format
application/pdf
text version
author
rights
This is not the published version. Please cite only the published version. この論文は出版社版ではありません。引用の際には出版社版をご確認、ご利用ください。
relation url
department
Graduate School of Advanced Science and Engineering