Thermal Propagation and Device-Temperature Prediction Techniques for Power Semiconductor Modules with Circuit Simulators
Use this link to cite this item : https://ir.lib.hiroshima-u.ac.jp/00029703
| ID | 29703 |
| file | |
| title alternative | 回路シミュレータを用いたパワー半導体モジュールにおける熱伝搬と素子温度予測技術
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| creator |
Kojima, Takashi
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| NDC |
Electrical engineering
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| language |
eng
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| nii type |
Thesis or Dissertation
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| HU type |
Doctoral Theses
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| DCMI type | text
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| format | application/pdf
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| rights | Copyright(c) by Author
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| relation references | (1) Capability of Electrothermal simulation for Automotive Power Application Using Novel Laterally Diffused Metal Oxide Semiconductor Model, T. Kojima, T. Kajiwara, M. Miyake, U. Feldmann and M. Miura-Mattausch, Japanese Journal of Applied Physics, Vol. 48, No. 4, Issue 2, 04C079 (6 pages), 2009.
(1) Extraction of Accurate Thermal Compact Models for Fast Electro-Thermal Simulation of IGBT Modules in Hybrid Electric Vehicles, M. Ciappa, W. Fichtner, T. Kojima, Y. Yamada and Y. Nishibe, Microelectronics Reliability, Vol 45, pp. 1694-1699, 2005.
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| relation references URL | http://dx.doi.org/10.1143/JJAP.48.04C079
http://dx.doi.org/10.1016/j.microrel.2005.07.083
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| grantid | 甲第4820号
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| degreeGrantor | 広島大学(Hiroshima University)
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| degreename Ja | 博士(工学)
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| degreename En | Engineering
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| degreelevel | doctoral
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| date of granted | 2009-03-06
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| department |
Graduate School of Advanced Sciences of Matter
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