このエントリーをはてなブックマークに追加
ID 30798
file
creator
Arriffin, Norzafriza
subject
Copper
Nanoparticles
Conductive film
Oxidation
Reduction
NDC
Metal and mining engineering
abstract
Copper nanoparticles with a mean diameter of 20 nm were used to prepare electrical conductive films at low temperature. After dispersal in an organic solvent, the copper nanoparticle pastes were coated onto a glass substrate, which was then annealed under various conditions to investigate the effects of various atmospheric conditions, such as air, nitrogen gas or hydrogen gas, as well as different annealing temperatures. Two-step annealing, which first involves oxidation in air followed by reduction, is effective in the preparation of high electrical conductive copper nanoparticle films. The copper nanoparticle films that were calcined in air for 1 h and then hydrogen gas for 1 h at a low temperature of 200 C showed a low resistivity of 2 x 10(-5) Omega, cm.
journal title
Thin Solid Films
volume
Volume 518
issue
Issue 23
start page
7033
end page
7037
date of issued
2010-09-30
publisher
Elsevier Science SA
issn
0040-6090
ncid
publisher doi
language
eng
nii type
Journal Article
HU type
Journal Articles
DCMI type
text
format
application/pdf
text version
author
rights
Copyright (c) 2010 Elsevier B.V.
relation url
department
Graduate School of Engineering