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ID 18586
file
creator
Yoshimoto, Takashi
Kidera, Toshirou
abstract
Thin (equivalent oxide thickness Teq of 2.4 nm) silicon nitride layers were deposited on Si substrates by an atomic-layer-deposition (ALD) technique at low temperatures (<550°C). The interface state density at the ALD silicon nitride/Si-substrate interface was almost the same as that of the gate SiO2. No hysteresis was observed in the gate capacitance-gate voltage characteristics. The gate leakage current was the level comparable with that through SiO2 of the same Teq. The conduction mechanism of the leakage current was investigated and was found to be the direct tunneling. The ALD technique allows us to fabricate an extremely thin, very uniform silicon nitride layer with atomic-scale control for the near-future gate dielectrics.
journal title
Applied Physics Letters
volume
Volume 79
issue
Issue 5
start page
665
end page
667
date of issued
2001-07-30
publisher
American Institute of Physics
issn
0003-6951
ncid
publisher doi
language
eng
nii type
Journal Article
HU type
Journal Articles
DCMI type
text
format
application/pdf
text version
publisher
rights
Copyright (c) 2001 American Institute of Physics.
relation url
department
Research Center for Nanodevices and Systems