Enhancement of BTI degradation in pMOSFETs under high-frequency bipolar gate bias

IEEE Electron Device Letters Volume 26 Issue 6 Page 387-389 published_at 2005-06
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Title ( eng )
Enhancement of BTI degradation in pMOSFETs under high-frequency bipolar gate bias
Creator
Zhu Shiyang
Ohashi Takuo
Miyake Hideharu
Source Title
IEEE Electron Device Letters
Volume 26
Issue 6
Start Page 387
End Page 389
Abstract
Negative bias temperature (NBT) instability of p-MOSFETs with ultrathin SiON gate dielectric has been investigated under various gate bias configurations. The NBT-induced interface trap density (ΔNit) under unipolar bias is essentially lower than that under static bias, and is almost independent of the stress frequency up to 10 MHz. On the contrary, ΔNit under bipolar pulsed bias of frequency larger than about 10 kHz is significantly enhanced and exhibits a strong frequency dependence, which has faster generation rate and smaller activation energy as compared to other stress configurations. The degradation enhancement is attributed to the energy to be contributed by the recombination of trapped electrons and free holes upon the silicon surface potential reversal from accumulation to inversion.
Keywords
Dynamic stress
Negative bias temperature instability (NBTI)
pMOSFETs
Recombination
Ultrathin gate oxide
NDC
Electrical engineering [ 540 ]
Language
eng
Resource Type journal article
Date of Issued 2005-06
Rights
Copyright (c) 2005 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
Publish Type Version of Record
Access Rights open access
Source Identifier
[ISSN] 0741-3106
[DOI] 10.1109/LED.2005.848075
[NCID] AA00231428
[DOI] http://dx.doi.org/10.1109/LED.2005.848075